TSMC
A timeline of the US semiconductor market in 2025 | TechCrunch
It’s been a tumultuous year for the U.S. semiconductor industry. The semiconductor industry plays a sizable role in the “AI race” that the U.S. seems determined to win, which is why this context is worth paying attention to: from Intel’s appointment of Lip-Bu Tan to CEO — who wasted no time getting to work trying…
TSMC swats down claims it is delaying its Japan chipmaking plant to prioritize Arizona plants to avoid US tariffs — TSMC says US investments won’t impact other regions
TSMC has responded to a report that it is delaying its Japan fab in favor of faster buildouts in the United States. According to a report from the Wall Street Journal, citing sources familiar with the matter, TSMC is slowing its spending on chipmaking facilities in Japan to accelerate the buildout of its Fab 21 site…
Intel details 18A process technology — takes on TSMC 2nm with 30% density gain and 25% faster generational performance
Intel has published a paper about its 18A (1.8nm-class) fabrication process at the VLSI 2025 symposium, consolidating all its information about the manufacturing technology into a single document. The new 18A production node is expected to deliver significant improvements in power, performance, and area over its predecessor, increasing density by 30% while enhancing performance by…
TSMC SVP Kevin Zhang opens up on process technology development & evolving demands: Interview
We had the opportunity to interview TSMC’s Kevin Zhang, the deputy co-COO and SVP at TSMC, to discuss the latest trends in the semiconductor industry and how they impact TSMC’s strategy moving forward. Since its founding in the 1980s, TSMC’s business strategy has been to meticulously fulfill the needs of its customers, transforming itself in…
TSMC mulls massive 1000W-class multi-chiplet processors with 40X the performance of standard models
You might often think of processors as being relatively small, but TSMC is developing a version of its CoWoS technology that will enable its partners to build multi-chiplet assemblies that will be 9.5-reticle sized (7,885 mm^2) and will rely on 120×150 mm substrates (18,000 mm^2), which is slightly larger than the size of a CD…
TSMC expands investments in the U.S. to $165 billion with new fabs and R&D center: A closer look
On Monday, TSMC announced plans to invest $100 billion in expanding its U.S. manufacturing capacity. The funds will go toward three additional fabs, two advanced packaging plants, and a major R&D facility. We spoke with the company to learn more about its plans and some additional details. The extra $100 billion investment adds to TSMC’s…