thermal
PCB design tips for EMI and thermal management in 800G systems
As the industry accelerates toward 800G Ethernet and optical interconnects, engineers face new challenges in managing electromagnetic interference (EMI) while ensuring signal integrity at unprecedented speeds. The transition to 112G pulse amplitude modulation 4-level (PAM4) SerDes introduces faster edge rates and dense spectral content, elevating the risk of radiated and conducted emissions. Simultaneously, compact module…
Acer Predator Helios 16 review: A lightning-fast performer with stellar thermal design
Table of Contents Table of Contents Table of ContentsAcer Predator Helios 16 price and specs This won’t easily double as a work laptop in appearanceA large, bright, and matte display that’s not super vibrantThe ports of a gamer’s dreamsThe speakers are passable, but not for listening to musicA fairly punchy keyboard and a smooth trackpadAcer Predator…
Cooler Master’s X Silent Edge Platinum is a showcase of advanced thermal engineering, but it comes with a steep price tag
Why you can trust Tom’s Hardware Our expert reviewers spend hours testing and comparing products and services so you can choose the best for you. Find out more about how we test. Cooler Master, founded in 1992, is a well-known manufacturer specializing in high-performance PC hardware components and cooling solutions. The company offers a wide…
DRAM basics and its quest for thermal stability by optimizing peripheral transistors
For decades, compute architectures have relied on dynamic random-access memory (DRAM) as their main memory, providing temporary storage from which processing units retrieve data and program code. The high-speed operation, large integration density, cost-effectiveness, and excellent reliability have contributed to the widespread adoption of DRAM technology in many electronic devices. DRAM bit cell—the element that…