
NextGeneration

Automating FOWLP design: A comprehensive framework for next-generation integration
Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a significant shift in system integration strategies. Industry analyses show 3D IC and advanced packaging make up more than 45% of the IC packaging market value, underscoring the move to more sophisticated solutions. The challenges are significant—from thermal management and testing…

Alibaba Qwen Team Releases Mobile-Agent-v3 and GUI-Owl: Next-Generation Multi-Agent Framework for GUI Automation
Image source: Marktechpost.com Introduction: The Rise of GUI Agents Modern computing is dominated by graphical user interfaces across devices—mobile, desktop, and web. Automating tasks in these environments has traditionally been limited to scripted macros or brittle, hand-engineered rules. Recent advances in vision-language models offer the tantalizing possibility of agents that can understand screens, reason about…

TechCrunch Mobility: How Jony Ive’s LoveFrom helped Rivian and what Uber’s next-generation playbook looks like | TechCrunch
Welcome back to TechCrunch Mobility — your central hub for news and insights on the future of transportation. Sign up here for free — just click TechCrunch Mobility! I’ve spent a decade covering Tesla and CEO Elon Musk, so it would be natural for me to weigh in here about the billionaire’s public fallout with…

Neural Processing Units (NPUs): The Driving Force Behind Next-Generation AI and Computing
Just as GPUs once eclipsed CPUs for AI workloads, Neural Processing Units (NPUs) are set to challenge GPUs by delivering even faster, more efficient performance—especially for generative AI, where massive real-time processing must happen at lightning speed and at lower cost. The question is how do NPUs work, and why are they edging out their…