mulls
TSMC mulls massive 1000W-class multi-chiplet processors with 40X the performance of standard models
You might often think of processors as being relatively small, but TSMC is developing a version of its CoWoS technology that will enable its partners to build multi-chiplet assemblies that will be 9.5-reticle sized (7,885 mm^2) and will rely on 120×150 mm substrates (18,000 mm^2), which is slightly larger than the size of a CD…