Intel details 18A process technology — takes on TSMC 2nm with 30% density gain and 25% faster generational performance

Intel details 18A process technology — takes on TSMC 2nm with 30% density gain and 25% faster generational performance

Intel has published a paper about its 18A (1.8nm-class) fabrication process at the VLSI 2025 symposium, consolidating all its information about the manufacturing technology into a single document. The new 18A production node is expected to deliver significant improvements in power, performance, and area over its predecessor, increasing density by 30% while enhancing performance by…

Read More
Intel hedges its bet for High-NA EUV with the 14A process node — an alternate Low-NA technique has identical yield and design rules

Intel hedges its bet for High-NA EUV with the 14A process node — an alternate Low-NA technique has identical yield and design rules

Intel explained the rationale behind its High-NA EUV strategy at its Intel Foundry Direct 2025 conference this week. Despite persistent questions around cost-effectiveness, Intel has championed its use of the new High-NA EUV chipmaking tool with its forthcoming 14A process. However, Intel has not yet fully committed to using the new tool in production, but…

Read More
Intel Foundry Roadmap Update – New 18A-PT variant that enables 3D die stacking, 14A process node enablement

Intel Foundry Roadmap Update – New 18A-PT variant that enables 3D die stacking, 14A process node enablement

Intel’s new CEO Lip Bu-Tan took to the stage at the company’s Intel Foundry Direct 2025 event here in San Jose, California, to outline the company’s progress on its foundry initiative. Tan announced that the company is now engaging lead customers for its upcoming 14A process node (1.4nm equivalent), the follow-on generation of its 18A…

Read More
Intel has championed High-NA EUV chipmaking tools, but costs and other limitations could delay industry-wide adoption: Report

Intel has championed High-NA EUV chipmaking tools, but costs and other limitations could delay industry-wide adoption: Report

Intel has made significant strides in implementing High-NA EUV lithography by installing two High-NA litho machines, developing custom reticles as well as all-new optical proximity correction, and processing 30,000 wafers. However, major hurdles remain: the $380 million – $400 million tool cost and potential necessity to overhaul photomask supply chain limits economic viability of the…

Read More