Automating FOWLP design: A comprehensive framework for next-generation integration

Automating FOWLP design: A comprehensive framework for next-generation integration

Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a significant shift in system integration strategies. Industry analyses show 3D IC and advanced packaging make up more than 45% of the IC packaging market value, underscoring the move to more sophisticated solutions. The challenges are significant—from thermal management and testing…

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Using generative AI, researchers design compounds that can kill drug-resistant bacteria

Using generative AI, researchers design compounds that can kill drug-resistant bacteria

With help from artificial intelligence, MIT researchers have designed novel antibiotics that can combat two hard-to-treat infections: drug-resistant Neisseria gonorrhoeae and multi-drug-resistant Staphylococcus aureus (MRSA). Using generative AI algorithms, the research team designed more than 36 million possible compounds and computationally screened them for antimicrobial properties. The top candidates they discovered are structurally distinct from any…

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