Automating FOWLP design: A comprehensive framework for next-generation integration

Automating FOWLP design: A comprehensive framework for next-generation integration

Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a significant shift in system integration strategies. Industry analyses show 3D IC and advanced packaging make up more than 45% of the IC packaging market value, underscoring the move to more sophisticated solutions. The challenges are significant—from thermal management and testing…

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A Comprehensive Guide to LLM Routing: Tools and Frameworks

A Comprehensive Guide to LLM Routing: Tools and Frameworks

Deploying LLMs presents challenges, particularly in optimizing efficiency, managing computational costs, and ensuring high-quality performance. LLM routing has emerged as a strategic solution to these challenges, enabling intelligent task allocation to the most suitable models or tools. Let’s delve into the intricacies of LLM routing, explore various tools and frameworks designed for its implementation, and…

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