Chiplet
Chiplet design basics for engineers
The world is experiencing an insatiable and rapidly growing demand for artificial intelligence (AI) and high-performance computing (HPC) applications. Breakthroughs in machine learning, data analytics, and the need for faster processing across all industries fuel this surge. Application-specific integrated circuits (ASICs), typically implemented as system-on-chip (SoC) devices, are central to today’s AI and HPC solutions….
New EDA tools arrive for chiplet integration, package verification
The world we are living in is increasingly becoming software-defined, where artificial intelligence (AI) is adding the next layer of functionality. And it’s driving the need for more compute to enable the software-enabled functionality. However, with this huge progression in compute content, Moore’s Law scaling will be insufficient to support the number of transistors for…
Chiplet basics: Separating hype from reality
There’s currently a significant buzz within the semiconductor industry around chiplets, bare silicon dies intended to be combined with others into a single packaged device. Companies are beginning to plan for chiplet-based designs, also known as multi-die systems. Yet, there is still uncertainty about what designing chiplet architecture entails, which technologies are ready for use,…