Chiplet basics: Separating hype from reality

Chiplet basics: Separating hype from reality

There’s currently a significant buzz within the semiconductor industry around chiplets, bare silicon dies intended to be combined with others into a single packaged device. Companies are beginning to plan for chiplet-based designs, also known as multi-die systems. Yet, there is still uncertainty about what designing chiplet architecture entails, which technologies are ready for use,…

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DRAM basics and its quest for thermal stability by optimizing peripheral transistors

DRAM basics and its quest for thermal stability by optimizing peripheral transistors

For decades, compute architectures have relied on dynamic random-access memory (DRAM) as their main memory, providing temporary storage from which processing units retrieve data and program code. The high-speed operation, large integration density, cost-effectiveness, and excellent reliability have contributed to the widespread adoption of DRAM technology in many electronic devices. DRAM bit cell—the element that…

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