Automating
Automating FOWLP design: A comprehensive framework for next-generation integration
Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a significant shift in system integration strategies. Industry analyses show 3D IC and advanced packaging make up more than 45% of the IC packaging market value, underscoring the move to more sophisticated solutions. The challenges are significant—from thermal management and testing…